StarTech 1.5g Metal Oxide Thermal CPU Paste for Heatsink
$10.00 Inc GST
StarTech 1.5g Metal Oxide Thermal CPU Paste for Heatsink
14 in stock
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Description
Description:
Provide optimal heat transfer between CPU and heatsink through a metal oxide compound – Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink. A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage. Please see our support section for the Material Safety Data Sheet for SILVGREASE1.
Key Features:
- Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications
- Metal-based compound containing metal oxide
- Thermal conductivity of more than 1.93 W/m-K
- Negligible electrical conductivity
- Stable performance over a wide temperature range
- Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications
- Metal-based compound containing metal oxide
Related
Additional information
Weight | 0.2 kg |
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Dimensions | 21 × 19 × 3 cm |
Brand Name |